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Submit a Manuscript to the Journal
Journal of Engineering Design

For a Special Issue on
Cognitive Intelligence-enabled Design, Manufacturing, Maintenance and Beyond

Manuscript deadline
30 October 2023

Cover image - Journal of Engineering Design

Special Issue Editor(s)

Tao Peng, Zhejiang University, China
[email protected]

Pai Zheng, The Hong Kong Polytechnic University, Hong Kong
[email protected]

Beshoy Morkos, University of Georgia, USA
[email protected]

Chun-Hsien Chen, Nanyang Technological University, Singapore
[email protected]

Ajith Kumar Parlikad, University of Cambridge, UK
[email protected]

Lihui Wang, KTH Royal Institute of Technology, Sweden
[email protected]

Submit an ArticleVisit JournalArticles

Cognitive Intelligence-enabled Design, Manufacturing, Maintenance and Beyond

Globally, manufacturing industries are transitioning from technology-driven to value-driven development. These industries are prominent in using innovative technologies to create and improve existing products by capitalizing on existing and foreseeable ICT infrastructure in areas such as automation, computation, informatization, and digitalization. Despite the improvements in the development of data-rich and knowledge-intensive systems, manufacturing companies still struggle to fully mine and interpret industrial data in ways that enhance their processes and products. Meanwhile, emerging technologies, including deep learning, knowledge graphs, and cognitive computing, are maximizing available data to create more so-called Self-X (e.g., self-learning, self-optimization, self-healing, etc.) manufacturing processes toward value-driven sustainability with higher cognitive intelligence. This has great potentials in innovative engineering design, dynamic manufacturing process optimization, human-machine/robot interaction, predictive/preventative maintenance, and decision support through various engineering lifecycle stages. Nevertheless, it is yet uncertain how cognitive intelligence may be used profitably and securely in design, manufacturing and beyond. Hence, this special issue aims to collect state-of-the-art cognitive intelligence research in innovative design, smart manufacturing and interdisciplinary domains. The goal is to identify the challenges and opportunities for broader impact and applications of cognitive intelligence.

To contribute to those areas, submissions in the following topics, but are not limited to, are highly encouraged:

  • Advances in cognitive intelligence fundamentals/theories
  • Knowledge extraction/representation for cognitive intelligence
  • Knowledge graph and graph-based reasoning for cognitive intelligence
  • Cognitive intelligence in design, manufacturing, and operations engineering
  • Cognitive intelligence in smart city/healthcare/mobility
  • Cognitive intelligence for sociotechnical/econotechnical systems
  • Cognitive intelligence for design and operation of human-cyber-physical systems
  • Cognitive innovative product/system design and cognitive factory
  • Cognitive digital twin for manufacturing systems
  • Cognitive human-robot collaboration systems
  • Cognitive predictive maintenance
  • Cognitive prognostics and health management
  • Self-organizing manufacturing networks/systems
  • Self-anomaly-detection in manufacturing processes
  • Self-coordinating supply chains/networks
  • Self-diagnosis of intelligent machines/products
  • Cognitive intelligence for future of work at the human-technology frontier
  • Case studies and industrial best practice of cognitive intelligence

Authors should submit their manuscripts via the journal submission site and please visit the Instructions for Authors page for information on preparing your manuscript.

Submission Instructions

Target Dates

Submission deadline: August 31, 2023; Initial review completed: October 30, 2023; Final decision:  December 31, 2023; Publication on a rolling basis. Papers received after the submission deadline may still be considered for this special issue, if time and space permits.

Guest Editors: Tao Peng, Zhejiang University, China, [email protected]; Pai Zheng, The Hong Kong Polytechnic University, Hong Kong, [email protected]; Beshoy Morkos, University of Georgia, USA, [email protected]; Chun-Hsien Chen, Nanyang Technological University, Singapore, [email protected]; Ajith Kumar Parlikad, University of Cambridge, UK, [email protected]; Lihui Wang, KTH Royal Institute of Technology, Sweden, [email protected]

Authors should submit their manuscripts via the journal submission site and please visit the Instructions for Authors page for information on preparing your manuscript.

- Select "special issue title: Cognitive Intelligence” when submitting your paper to ScholarOne

- Submissions can take the form of original research contributions, technical notes or perspectives/editorials, as well as the-state-of-the-art review and positioning papers.

- Expected publication date: December 31, 2023.

Instructions for AuthorsSubmit an Article

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