Journal of Adhesion Science and Technology

The adhesion of materials in AM refers to the bond strength between successive layers or between the substrate of AM machine and the deposited material. Insufficient and improper adhesion of layers results in reduced mechanical properties, part failure or compromised structural integrity and is chiefly affected by material properties, surface preparation, process parameters, pre-processing and post-processing techniques. The focus of this special issue is to provide alternative solutions such as parametric analysis of AM methods, evaluating the performance of bonded joint, analysis of bonding structure, examination of interface of layer, understanding tribological performance, evaluation of microstructure, defects, homogeneity, damage of bonded layers etc. to enhance and achieve optimal adhesion in AM processes.

The framework of this special issue is of interest to academicians, industrialists, researchers and scientists who are working in adhesion of different kinds of materials processed by AM techniques and to deliver innovative ideas to implement advanced strategies of adhesion in material processing.

The scope of this special issue includes (but is not limited to):

• Adhesion joint of 3D printed materials
• Adhesively bonded joints incorporating reinforcement in material for processing by AM techniques
• Examination of adhesive bonding between substrate of AM machine and printed material
• Parametric analysis of adhesion joints between layers of additively manufactured parts
• Performance of bonding structures
• Influence of time and temperature on level of adhesion between substrate and printed material
• Destructive and non-destructive testing of adhesively bonded joints fabricated by AM approaches
• Additives in improving adhesion between layer of AM fabricated parts
• Analysis of surface and interface of adhesively bonded joint produced by AM methods
• Characterization and modeling of adhesively engineered joints
• Numerical, experimental, and computational approaches to analyze interfacial layers of adhesive joints
• Tribological performance of adhesively bonded layers
• Interface degradation and damage of adhesively bonded layers fabricated by AM methods
• Exploration of defects and remedies at interface of adhesively bonded layers of AM parts
• Utilization of tools of Industry 4.0 in improving adhesion of dissimilar materials
• Understanding microstructure of adhesively bonded joint between layers of part manufactured by AM
• Preprocessing techniques of AM materials for adhesion improvement
• Post-processing strategies to enhance properties of adhesively bonded joints
• Nature and bio-inspired algorithms to understand adhesive bonding of materials processed by AM techniques
• Understanding adhesive bonding of smart materials/Biomaterials/High Entropy materials/Functionally graded materials/Nanomaterials/Carbon Materials/Self-Healing materials/ Hard-to-form materials fabricated by additive manufacturing techniques
• Properties, durability, recyclability and reliability of adhesive bonded joint fabricated by AM methods.

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