Submit a Manuscript to the Journal
Materials Research Letters
For an Article Collection on
Micro and Nanoscale Thermal Transport in Materials
Manuscript deadline
08 November 2023

Article collection guest advisor(s)
Tianli Feng,
University of Utah
[email protected]
Micro and Nanoscale Thermal Transport in Materials
When approaching micro and nanoscale, heat transfer exhibits many unique and intriguing characteristics compared to traditional diffusion process. Many materials show interesting thermal transport phenomena, such as non-Fourier transport, ballistic phonons, phonon nonequilibrium, wave-like phonon transport, ultra-high thermal conductivity, ultra-low thermal conductivity, inelastic and elastic phonon transmission, phonon confinement, phonon focusing, phonon-phonon and phonon-electron scattering, hydrodynamic heat transfer, etc.
Understanding micro and nanoscale thermal transport and finding materials with interesting thermal properties are critical for both fundamental science and cutting-edge technologies. The knowledge will enable targeted engineering of heat transport in materials for specific applications, such as thermal management, thermal metamaterials, thermal barrier coatings, thermoelectrics, thermal insulation, etc.
This collection, “Micro and Nanoscale Thermal Transport in Materials”, calls for papers that cover the materials with interesting micro and nanoscale thermal transport properties or phenomena, which can be either experimental or computational, or both. We invite original research papers as well as review articles. Subtopics are not limited.
Tianli Feng is an assistant professor of the Department of Mechanical Engineering at the University of Utah. Before his current appointment, he was an R&D Associate Staff Scientist at Oak Ridge National Laboratory. He received his M.S. and Ph.D. degrees from the School of Mechanical Engineering at Purdue University. He received his B.S. degree in Physics from the University of Science and Technology of China (USTC).
Disclosure Statement: Tianli has no conflicts of interest to disclose regarding this work.
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Choose open accessSubmission Instructions
All manuscripts submitted to this Article Collection will undergo desk assessment and peer-review as part of our standard editorial process. Guest Advisors for this collection will not be involved in peer-reviewing manuscripts unless they are an existing member of the Editorial Board. Please review the journal Aims and Scope and author submission instructions prior to submitting a manuscript.